Referring to FIG. 7, electrically insulating material on the upper main surface of the structure shown in FIG. 6 may be removed, for instance by laser processing, mechanically grinding or chemically so as to expose electrically conductive material of the electrically conductive layer structures 104, 110. In other words, it is possible to uncover or clean the copper surface of the panel-flipped substrate (such a procedure can be carried out in both alternatives which have been described above referring to FIG. 3, FIG. 4 and FIG. 5, FIG. 6).
In order to obtain the structure shown in FIG. 8, it is possible to remove the temporary carrier 170. The latter is now no longer needed, since the constituents of the structure shown in FIG. 8 have now been rigidly connected by the adhesive 174 or the laminated electrically insulating layer structure 132, respectively. Thus, it is now possible to peel off the temporary carrier 170 (which can, in an alternative embodiment, also be carried out before the procedure described referring to FIG. 7).
