Referring to FIG. 22, a substrate-type second component carrier 108 according to another exemplary embodiment of the invention is shown having an alternating sequence of four patterned metal foils (as second electrically conductive layer structures 110) and three dielectric layers (as second electrically insulating layer structures 112). Apart from this, two of the patterned metal foils are interconnected by an interlayer connect 120 (which may be embodied as copper filled laser via).
Referring to FIG. 23, another second component carrier 108 is illustrated being embodied as a substrate of the type shown in FIG. 21 and having a surface mounted component 124.
Referring to FIG. 24, still another second component carrier 108 is illustrated being embodied as a substrate of the type shown in FIG. 21 and having an intermediate functional layer 184 in its interior (such as a heat removal layer, an electromagnetic radiation shielding layer, an impedance controlled electric connection, etc.).
Preferably, the width of the diced boards shown in FIG. 21 to FIG. 24 can be substantially the same as the deepness of the cavity 114 of the first component carrier 102.
