Component carrier connected with a separate tilted component carrier for short electric connection
摘要
說明書
In an embodiment, the at least one second electrically conductive layer structure of the second component carrier comprises an electrically conductive trace electrically connecting at least one electrically conductive structure, in particular at least two electrically conductive structures, of the first component carrier. Such an electrically conductive trace may be formed by patterning an electrically conductive layer of the second component carrier. When the mentioned electrically conductive trace is in physical contact with and extends between two electrically conductive structures of the first component carrier at different height levels, a highly compact vertical interconnection may be established. A substantially identical via shape between first component carrier and second component carrier is preferred.
