In some embodiments, the switched inductor DC-DC power converter chiplet 10 and cross-section 30 include a plurality of inductors, each of which can be the same or similar to inductor 370. The plurality of inductors can be arranged in parallel electrically with one another, in series electrically with one another, or a combination thereof. The plurality of inductors can be integrated on the same integration planes 222 or in different integration planes 222.

FIGS. 4A and 4B are schematics of switched inductor DC-DC power converter chiplets 40A, 40B, respectively, to illustrate possible locations to integrate the thin-film inductor. In FIG. 4A, the thin-film inductor 470A is integrated on the same side of chiplet 40A as the electrical terminations 430, for example as illustrated in cross sections 20 and 30. Electrical terminations 430 can be the same as or similar to IC chip contact structures 230. In FIG. 4B, the thin-film inductor 470B is integrated on the opposite or back side of chiplet 40B with respect to the electrical terminations 430. Through-silicon VIAs 440 electrically connect the thin-film inductor 470B to the multilevel wiring network on the opposite side of chiplet 40B.