High frequency signal cross-layer transmission structure in multi-layer printed circuit board
地域：
New Taipei
摘要
A high frequency signal cross-layer transmission structure in a multi-layer printed circuit board includes a bottom metal layer, a middle metal layer and a top metal layer. The bottom metal layer includes a bottom ground plane and a bottom conductive area. The middle metal layer includes a middle ground plane. The top metal layer includes a top ground plane and a top conductive area. The bottom ground plane defines and surrounds a bottom annular clearance area. The middle ground plane defines and surrounds a middle clearance area. The top ground plane defines and surrounds a top annular clearance area. The bottom annular clearance area surrounds at least one part of the bottom conductive area. The top annular clearance area surrounds at least one part of the top conductive area. A size-shape of the top annular clearance area is different from a size-shape of the middle clearance area.
說(shuō)明書
The present invention relates to a multi-layer printed circuit board, and especially relates to a high frequency signal cross-layer transmission structure in a multi-layer printed circuit board.
In a multi-layer circuit board (such as a multi-layer printed circuit board) and low-temperature/high-temperature co-fired ceramic (LTCC/HTCC) structure, via holes (namely, via) are used to connect metals of different layers for signal transmission or grounding. If the signal is to be transmitted between different layers of the multi-layer circuit board, a plurality of the via holes are also required to form a cross-layer transmission structure. If the frequency of the transmitted signal is higher (for example, the millimeter wave, 30 GHz?300 GHz), or if the bandwidth of the transmitted signal is larger, the bad phenomena of the impedance discontinuity, the radiation loss, the resonance between substrates and the signal interaction coupling in the cross-layer transmission structure formed by the via holes are more serious.
權(quán)利要求
What is claimed is:1. A high frequency signal cross-layer transmission structure in a multi-layer printed circuit board, the high frequency signal cross-layer transmission structure comprising:a bottom metal layer; at least one middle metal layer arranged on the bottom metal layer; and a top metal layer arranged on the at least one middle metal layer, wherein the bottom metal layer comprises a bottom ground plane and a bottom conductive area; the at least one middle metal layer comprises at least one middle ground plane; the top metal layer comprises a top ground plane and a top conductive area; the bottom ground plane is configured to define a bottom annular clearance area; the bottom ground plane is configured to surround the bottom annular clearance area; the at least one middle ground plane is configured to define at least one middle clearance area; the at least one middle ground plane is configured to surround the at least one middle clearance area; the top ground plane is configured to define a top annular clearance area; the top ground plane is configured to surround the top annular clearance area; the bottom annular clearance area is configured to surround at least one part of the bottom conductive area; the top annular clearance area is configured to surround at least one part of the top conductive area; a size of the top annular clearance area is different from a size of the at least one middle clearance area, or a shape of the top annular clearance area is different from a shape of the at least one middle clearance area, to adjust an impedance characteristic of the high frequency signal cross-layer transmission structure; wherein a size of the bottom annular clearance area is different from the size of the at least one middle clearance area, or a shape of the bottom annular clearance area is different from the shape of the at least one middle clearance area, to adjust the impedance characteristic of the high frequency signal cross-layer transmission structure; wherein the bottom conductive area and the top conductive area are configured to define a center via hole; the bottom conductive area and the top conductive area are configured to surround the center via hole; the center via hole is through the bottom conductive area and the top conductive area; the bottom conductive area and the top conductive area are connected to each other through the center via hole, wherein the bottom ground plane, the at least one middle ground plane and the top ground plane are configured to define a plurality of ground via holes; the bottom ground plane, the at least one middle ground plane and the top ground plane are configured to surround the ground via holes; the bottom ground plane the at least one middle ground plane and the top ground plane are connected to the around via holes; wherein the bottom metal layer is configured to define a bottom isolation slot; the at least one middle metal layer is configured to define at least one middle isolation slot; the top metal layer is configured to define a top isolation slot; the bottom isolation slot is configured to surround the bottom ground plane and the ground via holes; the at least one middle isolation slot is configured to surround the at least one middle ground plane and the ground via holes; the top isolation slot is configured to surround the top ground plane and the ground via holes. 2. The high frequency signal cross-layer transmission structure in claim 1 , wherein the at least one middle ground plane is configured to define at least one radial slot in the at least one middle clearance area; the at least one middle ground plane is configured to surround the at least one radial slot. 3. The high frequency signal cross-layer transmission structure in claim 1 , wherein the bottom conductive area is a transmission line structure; the top conductive area is a transmission line structure. 4. The high frequency signal cross-layer transmission structure in claim 1 , wherein the high frequency signal cross-layer transmission structure is applied to an electronic component and further comprises at least one electronic component solder pad connected to the bottom conductive area or the top conductive area. 5. The high frequency signal cross-layer transmission structure in claim 1 , wherein the center via hole and the ground via holes are a plurality of plated through holes.
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