High frequency signal cross-layer transmission structure in multi-layer printed circuit board
摘要
說(shuō)明書
The bottom conductive area 114 and the top conductive area 116 define a center via hole (namely, center via) 118. The bottom conductive area 114 and the top conductive area 116 surround the center via hole 118. The center via hole 118 is through the top metal layer L1/the top conductive area 116, the first dielectric layer L11, the second dielectric layer L21, the third dielectric layer L31, the fourth dielectric layer L41, the fifth dielectric layer L51 and the bottom metal layer L6/the bottom conductive area 114. The top conductive area 116, the first dielectric layer L11, the second dielectric layer L21, the third dielectric layer L31, the fourth dielectric layer L41, the fifth dielectric layer L51 and the bottom conductive area 114 are connected to each other through the center via hole 118.
