In general, the PCBs (including the multiple heat-generating, electronic devices) may be considered an electronic subassembly of the electronic speaker device 100. While the electronic speaker device 100 is operating, the multiple heat-generating electronic devices may generate heat at a rate (e.g., watts) that, if not dissipated quickly, can damage the electronic speaker device 100.

This damage causing situation, referred to as thermal runaway, can have destructive impacts to the electronic speaker device 100 that include, for example, delamination of the PCBs and/or shortened life of components of the electronic speaker device 100 (e.g., the SoC IC component, the memory components, the audio amplifier, the audio inductors, Wi-Fi components, communication interfaces). In some instances, an operating temperature of the electronic speaker device 100 may exceed a threshold, causing the electronic speaker device 100 to simply shut down (e.g., a thermocouple or other temperature sensing device may provide feedback to a processor or temperature control unit of the electronic speaker device 100 and cause a thermal shut down).

To mitigate instances of thermal runaway, the electronic speaker device 100 includes the passive thermal-control structure 110 (e.g., a thermal-control system absent active components such as a powered fan, a powered pump exchanging fluids, and so on). The passive thermal-control structure 110 may include multiple components (e.g., front and rear thermal-structure components 116, 118), as well as thermal interface materials (e.g., TIM 120), to transfer heat from electronic subsystems of the electronic speaker device 100 to an interior wall of the housing.