In Example 2, evaluation is made on temperature fluctuation when a second heat treatment accompanied by a change in temperature is repeatedly performed by 20 runs. The heat treatment apparatuses used in Example 2 include a heat treatment apparatus which does not have the first partitions 70 and 72 and the second partition 80, a heat treatment apparatus which has the first partitions 70 and 72, and a heat treatment apparatus which has the first partitions 70 and 72 and the second partition 80.

FIG. 13 is a view illustrating a change over time in a set temperature of the second heat treatment accompanied by a change in temperature. In FIG. 13, time is illustrated on the horizontal axis, and temperature [□] is illustrated on the vertical axis. As illustrated in FIG. 13, in Example 2, the set temperature in the carry-in step in which the wafer W is carried into the processing container 4 is set to 400□. Further, the set temperature in the first film-forming step in which the film-forming is performed on the wafer W is set to 500□. Further, the set temperature in the second film-forming step in which the film-forming is performed on the wafer W is set to 630□. Further, the set temperature in the carry-out step in which the wafer W is carried out from the processing container 4 is set to 400□.