This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 202010178891.5 filed in China on Mar. 15, 2020, the entire contents of which are hereby incorporated by reference.

The invention relates to a cooling system, more particularly to a cooling system for a server.

As server technology progresses, server can provide higher performance and, hence, more heat. In order to prevent the working temperature too high to damage internal electronic components, an effective option is to provide an immersion cooling, where the immersion cooling is a new type of cooling technology that the heat source is immersed in a dielectric liquid (hereinafter referred to as the “coolant”) to directly absorb the heat generated therefrom. During the cooling process, the heat is transferred to the liquid coolant and the liquid coolant is transformed into a vapor coolant, and then the vapor coolant is condensed by a condenser located above the liquid coolant and the vapor coolant is condensed into the liquid coolant.

Since the condenser is typically placed above the liquid coolant, the maintenance personnel has to temporally remove the condenser to reach the heat sources immersed in the liquid coolant and to perform required maintenance processes. And during the maintenance processes, the vapor coolant will not be effectively condensed into the liquid coolant due to the removal of the condenser, thereby resulting in leakage of vapor coolant.