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Circuit board and light emitting device including circuit board

專利號(hào)
US11304291B2
公開(kāi)日期
2022-04-12
申請(qǐng)人
KYOCERA Corporation（JP Kyoto）
發(fā)明人
Yuichi Abe
IPC分類
H01L33/56; H05K1/02; H01L33/60; H01L33/62; H05K1/18; H05K3/26
技術(shù)領(lǐng)域
layer,filler,resin,silicone,reflective,equal,was,fillers,board,μm
地域： Kyoto

摘要

A circuit board according to the present disclosure includes a substrate, a conductor layer arranged on the substrate, a reflective layer arranged on the conductor layer, and a silicone-resin layer arranged on the substrate. The silicone-resin layer is in contact with the conductor layer and the reflective layer. The silicone-resin layer contains equal to or more than 45% by mass of a plurality of fillers. A first filler whose aspect ratio is larger than 5 occupies equal to or more than 5% of 100% of a total number of the fillers.

說(shuō)明書

FIELD

The present disclosure relates to a circuit board and a light emitting device including the circuit board.

BACKGROUND

A light emitting diode (LED) has drawn attention as a light emitting element whose power consumption is little. In mounting such a light emitting element, a circuit board including a non-conductive substrate and a conductive layer to be a circuit (wiring) positioned on the substrate is used.

Improvement in luminous efficiency is demanded for a light emitting device that is obtained by mounting a light emitting element on the circuit board having the above-mentioned configuration, and thus a surface of the substrate is covered by a resin whose color tone is a white-color tone in order to improve the luminous efficiency (see Patent Literature 1, for example).

CITATION LIST Patent Literature

Patent Literature 1: Japanese Patent Application Laid-open No. 2009-129801

SUMMARY Solution to Problem

A circuit board according to the present disclosure includes: a substrate; a conductor layer arranged on the substrate; a reflective layer arranged on the conductor layer; and a silicone-resin layer arranged on the substrate. The silicone-resin layer is in contact with the conductor layer and the reflective layer. The silicone-resin layer contains equal to or more than 45% by mass of a plurality of fillers, and a first filler whose aspect ratio is larger than 5 occupies equal to or more than 5% of 100% of a total number of the fillers.

權(quán)利要求

1
The invention claimed is:1. A circuit board comprising:a substrate;a conductor layer arranged on the substrate;a reflective layer arranged on the conductor layer; anda silicone-resin layer arranged on the substrate, the silicone-resin layer contacting the conductor layer and the reflective layer, whereinthe silicone-resin layer contains greater than or equal to 45% by mass of a plurality of fillers, and a first filler, whose aspect ratio is larger than 5, occupies greater than or equal to 5% of a total number of particles included in the plurality of fillers.2. The circuit board according to claim 1, whereinthe first filler is made of a silicon dioxide or a potassium titanate.3. The circuit board according to claim 1, whereinthe silicone-resin layer contains less than or equal to 80% by mass of the plurality of fillers.4. The circuit board according to claim 1, whereinthe first filler is less than or equal to 40% of the total number of the particles included in the plurality of fillers.5. The circuit board according to claim 1, whereina second filler made of a titanium dioxide occupies greater than or equal to 40% to less than or equal to 55% of the particles included in the total number of the plurality of fillers.6. The circuit board according to claim 5, whereinan average value of a circle equivalent diameter of the second filler is greater than or equal to 0.5 μm to less than or equal to 3 μm.7. The circuit board according to claim 1, whereina third filler made of a barium titanate occupies greater than or equal to 5% to less than or equal to 10% of the particles included in the total number of the plurality of fillers.8. The circuit board according to claim 7, whereinan average value of a circle equivalent diameter of the third filler is greater than or equal to 0.3 μm to less than or equal to 2 μm.9. The circuit board according to claim 1, whereina height of a surface of the silicone-resin layer is lower than a height of a surface of the reflective layer by greater than or equal to 5 μm.10. The circuit board according to claim 1, whereinan arithmetic mean roughness Ra1 obtained from a roughness curve of a surface of the silicone-resin layer is larger than an arithmetic mean roughness Ra2 obtained from a roughness curve of a surface of the reflective layer.11. The circuit board according to claim 1, whereinthe silicone-resin layer contains metal particles whose circle equivalent diameter is less than or equal to 5 μm, anda number of the metal particles in a surface of the silicone-resin layer is larger than that in an inner part of the silicone-resin layer.12. The circuit board according to claim 11, whereina number of the metal particles within a range having 1 mm2 in area on the surface is greater than or equal to 2 to less than or equal to 5.13. A light emitting device comprising:the circuit board according to claim 1; anda light emitting element arranged on the circuit board.
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