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Circuit board and light emitting device including circuit board

專利號
US11304291B2
公開日期
2022-04-12
申請人
KYOCERA Corporation(JP Kyoto)
發(fā)明人
Yuichi Abe
IPC分類
H01L33/56; H05K1/02; H01L33/60; H01L33/62; H05K1/18; H05K3/26
技術(shù)領(lǐng)域
layer,filler,resin,silicone,reflective,equal,was,fillers,board,μm
地域: Kyoto

摘要

A circuit board according to the present disclosure includes a substrate, a conductor layer arranged on the substrate, a reflective layer arranged on the conductor layer, and a silicone-resin layer arranged on the substrate. The silicone-resin layer is in contact with the conductor layer and the reflective layer. The silicone-resin layer contains equal to or more than 45% by mass of a plurality of fillers. A first filler whose aspect ratio is larger than 5 occupies equal to or more than 5% of 100% of a total number of the fillers.

說明書

Contents of the fillers in the silicone-resin layer 4 may be obtained by the following method. In the first place, the silicone-resin layer 4 is cut, and then is polished by using a Cross section polisher (CP) to obtain a polished surface. Next, by using an Energy Dispersive x-ray Spectroscopy (EDS) attached to a Scanning Electron Microscope (SEM), contents of components composing the silicone-resin layer 4 are measured. Or, the silicone-resin layer 4 is scraped off, and contents of components composing the silicone-resin layer 4 are measured by using an Inductively Coupled Plasma spectrometer (ICP) or an X-ray fluorescence spectrometer (XRF). When a total content of a silicon dioxide, a potassium titanate, an aluminum oxide, a silicon dioxide, a barium oxide, a barium sulfate, a zinc oxide, a titanium dioxide, a barium titanate, and a zirconium oxide, which compose the above-mentioned filler, is computed, the computed content is a content of the filler.

權(quán)利要求

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