Panel molded electronic assemblies with integral terminals
地域：
MA
MA Andover
摘要
Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.
說明書
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This is a divisional of U.S. patent application Ser. No. 16/218,395, filed on Dec. 12, 2018, the entire disclosure of which is incorporated herein by reference.
This invention relates to the field of encapsulated electronic assemblies, including encapsulated power converters, and more particularly to providing externally accessible connection terminals that provide a conductive path to elements within the encapsulated assembly.
An encapsulated electronic module, such as an electronic power converter module for example, may comprise a printed circuit assembly over-molded with an encapsulant to form some or all of the package and exterior structure or surfaces of the module. Encapsulation in this manner may aid in conducting heat out of the over-molded components, i.e., components that are mounted on the printed circuit assembly and covered with encapsulant. It is necessary to provide means for making electrical connections between the internal printed circuit assembly and external circuitry (e.g. an external printed circuit board; a socket). There are many known ways to make such connections, including, but not limited to, lead frames, pins, conductive terminals and flexible wire leads.
權利要求
What is claimed is:1. A method of forming electronic modules, the method comprising:assembling an electronic module including a multilayer printed circuit board (“PCB”) having a plurality of conductive layers, a first plurality of electronic components mounted to a first surface of the PCB, and a first layer of cured encapsulant covering the components and the surface of the PCB, the first layer of cured encapsulant forming a first exterior surface of the module, the electronic module including one or more conductive features buried beneath the first exterior surface; selectively forming one or more terminal holes in the first exterior surface through the first layer by removing the cured encapsulant at predetermined locations within perimeter boundaries of the electronic module, exposing within the one or more terminal holes respective portions of the one or more conductive features; inserting a conductive terminal into each of the one or more terminal holes; and forming an electrical connection between the conductive terminal and the respective portions of the one or more conductive features exposed within each of the one or more terminal holes; wherein assembling the electronic module comprises providing a PCB panel, mounting a plurality of electronic components to first and second surfaces of the PCB panel, encapsulating the PCB panel and electronic components to form an encapsulated panel, the encapsulated panel comprising a plurality of the electronic modules, and cutting the encapsulated panel to singulate the electronic modules. 2. The method of claim 1 wherein the forming an electrical connection for selected terminal holes includes forming a pressure fit between the respective conductive terminal and the respective portions of the one or more conductive features exposed within the selected terminal holes. 3. The method of claim 1 wherein the assembling the electronic module includes mounting at least one conductive component to the PCB, the at least one conductive component being covered by the first layer of cured encapsulant, and wherein forming the one or more terminal holes includes exposing the conductive component in a respective one of the terminal holes. 4. The method of claim 3 wherein the conductive component includes a hole feature covered by the first layer of cured encapsulant and approximately aligned with a location of the respective one of the terminal holes, and the forming the respective one of the terminal holes exposes the hole feature. 5. The method of claim 1 , further comprising selectively forming one or more conductive metal layers on a sidewall surface within each of selected terminal holes in electrical contact with the respective portions of the one or more conductive features exposed within the selected terminal holes. 6. The method of claim 1 , further comprising:selectively forming one or more mounting holes in the first exterior surface through the first layer at predetermined locations within perimeter boundaries of the electronic module, each mounting hole intersecting a respective second set of the conductive features to expose respective portions of the respective second set of conductive features in the respective mounting hole; and selectively forming one or more conductive metal layers on the first external surface and on a sidewall surface within each of selected mounting holes in electrical contact with the exposed respective portions of the respective second set of conductive features in the respective mounting hole to form a conductive metal mounting pad on the first exterior surface surrounding the respective mounting hole, the metal mounting pad being continuous with the one or more conductive metal layers on the interior surface of the respective mounting hole and providing an electrical contact on the first exterior surface connected to the exposed respective portions of the respective second set of the conductive features. 7. The method of claim 6 , further comprising patterning the one or more metal layers on the first exterior surface to form a metal shield electrically connected to at least one of the metal mounting pads and covering at least 25 percent of the first exterior surface. 8. The method of claim 7 wherein the metal shield covers at least 50 percent of the exterior module surface and connects a plurality of the mounting holes. 9. The method of claim 6 wherein at least one of the mounting holes extends completely through the module.
意見反饋