When the electronic device 700 is a WLAN apparatus, the electronic device 700 may include a Multiple BSS Capability module 170 and a management frame generation module 172, similar to those described in FIG. 1. When the electronic device 700 is a client STA, the electronic device 700 may include a management frame analysis module 125, similar to the module described in FIG. 1. In some implementations, one or more of the Multiple BSS Capability module 170, the management frame generation module 172, and the management frame analysis module 125 can be distributed within the processor unit 702, the memory unit 706, the bus 710, and the network interfaces 704. In some implementations, one or more of the Multiple BSS Capability module 170, the management frame generation module 172, and the management frame analysis module 125 (and optionally one or more of the processor 702, memory 706, and network interfaces 704) may be part of a wireless chipset of the electronic device 700. In some implementations, the wireless chipset also may be generally referred to as a wireless node, a wireless apparatus, or a communication unit (or module). In some implementations, the electronic device 700 also may be generally referred to as a wireless node or a wireless apparatus.