In some examples, the electronic devices 300 also include one or more electrical traces described above with respect to FIGS. 2A-5 to enable hermetic sealing of the devices 300 with a second substrate material (not shown). Further, such hermetic sealing may occur prior to singulation of the electronic devices 300. For example, the electronic devices 300 may be formed as described above with respect to FIG. 5. Subsequently, a power source may be electrically coupled to the electrical contacts 612a-b to supply current to the electrical trace 610. The heat generated by the electrical trace 610 may cut both the substrate 600 and the second substrate, thereby singulating the device 300.
Referring now to FIG. 7, FIG. 7 shows an example method 700 according to this disclosure. The description of FIG. 7 will be made with respect to the example substrate 600 shown in FIG. 6, though any suitable device or arrangement may be employed.
