At block 730, a power supply is coupled to the electrical trace 610. In this example, the power source is electrically coupled to the electrical contacts 612a-b to supply a voltage across the contacts 612a-b and to supply a current to the electrical trace 610. In some examples, however, the power source may be coupled to any two points on the electrical trace so long as current traverses the electrical trace 610. Further, in some examples, the electrical trace may be formed in a coil shape to enable wireless inductive coupling with a power source. In such examples, a physical electrical coupling may not be required, and instead, the power source may be electrically coupled using wireless inductive coupling.

At block 740, heat generated by the current flowing through the electrical trace 610 melts the first substrate 600. In this example, the heat melts the PCB or other suitable substrate material, thereby singulating the electronic devices 300.

It should be appreciated that the method 700 shown in FIG. 7 may be performed in conjunction with other example methods according to this disclosure, such as example methods according to the method 500 of FIG. 5. Such a method may be performed at any time before, during, or after the method 700 of FIG. 7 is performed. For example, the method 500 of FIG. 5 may be performed at block 720.