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Packaging techniques for electronic devices

專利號
US11445628B1
公開日期
2022-09-13
申請人
Verily Life Sciences LLC(US CA South San Francisco)
發(fā)明人
Jeff Clarkson; Roseann Ahlin
IPC分類
H05K5/06; H05K5/00; A61B5/145
技術領域
substrate,trace,electrical,mask,lcp,electronic,in,may,be,or
地域: CA CA South San Francisco

摘要

One disclosed method includes defining an electrical trace on a first substrate; physically coupling an electronic component to the first substrate, wherein a portion of the electrical trace completely encircles the electronic component; overlaying a second substrate onto the first substrate, the overlaying causing the second substrate to completely cover the portion of the electrical trace and the electronic component; electrically coupling an electrical power source to the electrical trace to generate a current in the electrical trace; melting the second substrate using heat generated by the current through the electrical trace; and fusing the second substrate to the first substrate to generate a hermetic seal around the electronic component.

說明書

FIG. 15A illustrates deposited mask material on a substrate after different deposition times 1510a-d. As can be seen, in image 1510a, nanoparticles of a silver mask material have a size of approximately 12 nm with substantial gaps visible between the particles. The particle sizes grow until adjacent particles join together, until ultimately only a few small gaps are visible in image 1510d.

FIG. 15B illustrates the same mask layers shown in FIG. 15A; however, the mask layers in FIG. 15B have been heat-soaked at 190 degrees Celsius for 50 minutes. As can be seen, the particles in each mask layer have coalesced into discrete particles, providing a discontinuous mask layer on the underlying substrate. Such an effect is visible even in image 1520d, which is the resulting mask layer following a heat-soak of the mask layer shown in image 1510d. Thus, a continuous, or nearly continuous, thin film of mask material may still be rendered into a suitable discontinuous mask layer via a thermal soak process.

Referring now to FIGS. 11A-11C, FIGS. 11A-11C illustrate the use of self-assembling masks to create surface roughness on a substrate. FIG. 11A shows a cross-section of a substrate 1100, such as an LCP substrate material, having a self-assembled mask formed on its surface from a masking material 1110. The self-assembled mask may be any suitable self-assembled mask that defines a plurality of gaps to expose the underlying substrate 1100, such as the masks 1020a-c shown in FIGS. 10A-10C.

權利要求

1
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