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System and method for managing airflow in a data center

專利號(hào)
US11445638B2
公開日期
2022-09-13
申請(qǐng)人
Baidu USA LLC(US CA Sunnyvale)
發(fā)明人
Tianyi Gao
IPC分類
H05K7/20
技術(shù)領(lǐng)域
aisle,air,cooling,hot,cold,layer,airflow,racks,in,room
地域: CA CA Sunnyvale

摘要

Described herein is an airflow management system and method. The system includes a top layer and a bottom layer, and each of the layers has a dedicated air flow management and hardware system that are operated independently. The top layer is a drop ceiling air plenum, and can store fan coils arranged in a hot aisle containment fashion or a cold hair containment fashion. The top layer receives fresh air from its own air source, and exhausts hot air through its own exhaust. The bottom layer can include server racks arranged in a hot aisle containment fashion or a cold aisle containment fashion. One or more servers in the bottom layer can include an air cooling component and a liquid cooling component, and receive cooling liquid from the top layer and receives cooling air from its own air source.

說明書

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FIELD OF THE INVENTION

Embodiments of the present disclosure relate generally to airflow management in a data center. More particularly, embodiments of the disclosure relate to a hybrid and modularized approach to managing airflow management in a data center.

BACKGROUND

With the booming of AI applications, cloud computing and data-driven applications, data centers have becoming increasingly critical for a company to maintain its competitive edges. Maintaining a data center is expensive and part of the expenses is related to cooling the data center.

A modern data center often includes servers with different lifetimes, and therefore requires frequent upgrading to cooling systems to meet the cooling needs. Further, a modern data center often uses a single air source, which may not be the most efficient cooling solution for all types of IT equipment or infrastructure. In addition, a modern data center typically only uses recirculated cooling air, whose quality may be much better than natural fresh air. Natural fresh air, whose quality is typically bad in some areas, can damage the electronics in the data center.

Therefore, a flexible, resilient, modularized, and hybrid cooling approach utilizing multiple air sources would reduce the cooling cost of a data center by increasing the cooling efficiency, as well as reducing the capital cost.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention are illustrated by way of example and not limitation in the figures of the accompanying drawings in which like references indicate similar elements.

權(quán)利要求

1
What is claimed is:1. An airflow management system for cooling a data center, comprising:a first layer that includes a plurality of fan coils; anda second layer under the first layer, and connected to the first layer through a plurality of liquid loops and a plurality of liquid connectors, the second layer including a plurality of electronic racks arranged in a plurality of rows, each electronic rack including one or more servers,wherein at least one server in the second layer includes a liquid cooling component and an air cooling component, andwherein the liquid cooling component receives cooling liquid from one of the plurality of fan coils through one of the plurality of liquid loops and one of the plurality of liquid connectors, and the air cooling component receives cooling air from a fresh air cooling system, wherein the fresh air cooling system is attached to the first layer and the second layer to cool both the first layer and the second layer, wherein the fresh air cooling system includes a fresh air intake, a fan wall, a filtration layer, and a cooling air chamber, and wherein the cooling air chamber is configured to generate different pressures and distribution patterns within the cooling air chamber to supply different amounts of air to the first layer and the second layer.2. The airflow management system of claim 1, wherein each of the one or more servers is placed on one of the plurality of electronic racks, the electronic rack further including a liquid distribution unit that receives the cooling liquid from one of the plurality of fan coils and distributes the received cooling liquid to the liquid cooling component in the server.3. The airflow management system of claim 1, wherein the first layer is a drop ceiling air plenum.4. The airflow management system of claim 1, wherein the cooling liquid is circulated between the liquid cooling component and the one of the plurality of fan coils.5. The airflow management system of claim 1, wherein the fresh air cooling system uses only fresh air, and does not use recirculated air.6. The airflow management system of claim 1, wherein the plurality of fan coils in the first layer are arranged in one of a cold aisle containment fashion or a hot aisle containment fashion.7. A method of managing airflow in a data center, comprising:providing a first layer that includes a plurality of fan coils;providing a second layer that is directly under the first layer and connected to the first layer through a plurality of liquid loops and a plurality of liquid connectors, the second layer including a plurality of electronic racks arranged in a plurality of rows, each electronic rack including one or more servers, wherein at least one server in the second layer includes a liquid cooling component and an air cooling component;receiving, by the liquid cooling component in each of the at least one the server, cooling liquid from one of the plurality of fan coils through one of the plurality of liquid loops and one of the plurality of liquid connectors; andreceiving, by the air cooling component in the server, cooling air from a fresh air cooling system, wherein the fresh air cooling system is attached to the first layer and the second layer to cool both the first layer and the second layer, wherein the fresh air cooling system includes a fresh air intake, a fan wall, a filtration layer, and a cooling air chamber, and wherein the cooling air chamber is configured to generate different pressures and distribution patterns within the cooling air chamber to supply different amounts of air to the first layer and the second layer.8. The method of claim 7, wherein each of the one or more servers is placed on one of the plurality of electronic racks, the electronic rack further including a liquid distribution unit that receives the cooling liquid from one of the plurality of fan coils, and distributes the received cooling liquid to the liquid cooling component in the server.9. The method of claim 7, wherein the first layer is a drop ceiling air plenum.10. The method of claim 7, wherein the cooling liquid is circulated between the liquid cooling component and the one of the plurality of fan coils.11. The method of claim 7, wherein the fresh air cooling system uses only fresh air, and does not use recirculated air.12. The method of claim 7, wherein the plurality of fan coils in the first layer are arranged in one of a cold aisle containment fashion or a loot aisle containment fashion.13. The method of claim 7, wherein each of the plurality of fan coils in the first layer corresponds to each of the plurality of electronic racks in the second layer.14. The method of claim 7, wherein the first layer further includes a plurality of hot air exhausts.
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