Driver board assemblies and methods of forming a driver board assembly
地域：
TX
TX Plano
摘要
A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.
說明書
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
The present specification generally relates to driver board assemblies and methods of forming a driver board assembly and, more specifically, driver board assemblies and methods of forming a driver board assembly including power devices embedded within a PCB substrate and providing an intermediate layer between the PCB substrate and a cooling assembly mounted to the PCB substrate to eliminate insulation and/or grease layers.
A power control unit (PCU) may be used in motor-drive hybrid and electric vehicles. PCUs may include power devices arranged in inverter and/or converter topologies, which are packaged in a plurality of power cartridges and which may be individually connected to a driver board. For more compact and higher power-density, power devices are embedded into the driver board, such as within a multilayer printed circuit board (PCB). The multilayer PCB has pre-preg layers and copper layers laminated to a single piece. However, using resin as the insulation layer of the multilayer PCB leads to high thermal resistance of the multilayer PCB, which results in high temperature differential from the power device to a cooling assembly. This, in turn, limits the multilayer PCB to lower power applications. For high power applications, the electrical insulation layer needs to have high thermal conductivity, such as ceramic. However, a grease layer is needed at least between the multilayer PCB and the cooling assembly. Again, however, the device temperature increases rapidly as the grease layer thickness increases because the heat generated by the power devices is not effectively spread in the multilayer PCB. As such, a need for alternative insulation strategies is needed.
權(quán)利要求
What is claimed is:1. A circuit board assembly comprising;a printed circuit board (PCB) substrate having a first surface and an opposite second surface, the second surface having a first electrical pattern; a cooling assembly thermally coupled to the second surface of the PCB substrate; an intermediate layer sandwiched between the second surface of the PCB substrate and the cooling assembly; one or more power devices embedded within layers of the PCB substrate between the first surface and the second surface; and a plurality of conductive layers arranged within the PCB substrate, the plurality of conductive layers configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly, wherein at least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate, and wherein the first electrical pattern and the second electrical pattern are a three-phase electrical pattern. 2. The circuit board assembly of claim 1 , wherein the cooling assembly comprises:a plurality of vias arranged within the PCB substrate. 3. The circuit board assembly of claim 2 , wherein:the cooling assembly is a cold plate mounted to the intermediate layer opposite the second surface of the PCB substrate, and wherein the intermediate layer thermally couples the cold plate to the plurality of conductive layers. 4. The circuit board assembly of claim 3 , wherein an upper surface of the cold plate includes a silver plated aluminum layer. 5. The circuit board assembly of claim 3 , wherein the intermediate layer is a direct bonded copper layer. 6. The circuit board assembly of claim 5 , wherein the first electrical pattern of the second surface of the PCB substrate and the second electrical pattern of the direct bonded copper layer both includes a U, V, W conductive layer architectures define the three-phase electrical pattern and a P and N conductive layer architectures. 7. The circuit board assembly of claim 3 , wherein the intermediate layer is a ceramic layer. 8. The circuit board assembly of claim 7 , further comprising:an upper solder paste positioned between the second surface of the PCB substrate and the ceramic layer; a lower solder paste positioned between the ceramic layer and the cold plate; and a solder layer positioned between the upper solder paste and the lower solder paste to mount the ceramic layer to the cold plate. 9. The circuit board assembly of claim 8 , wherein an upper surface of the cold plate includes a silver plated aluminum layer. 10. The circuit board assembly of claim 8 , wherein the first electrical pattern of the second surface of the PCB substrate and the second electrical pattern of the ceramic layer both includes a U, V, W conductive layer architectures define the three-phase electrical pattern and a P and N conductive layer architectures. 11. A circuit board assembly comprising;a printed circuit board (PCB) substrate having a first surface and an opposite second surface, the second surface having a first electrical pattern; a cooling assembly thermally coupled to the second surface of the PCB substrate; a second substrate sandwiched between the second surface of the PCB substrate and the cooling assembly, the second substrate having an upper substrate surface and an opposite lower substrate surface, the upper substrate surface having a first conductive layer, the first conductive layer having a first thickness, the lower substrate surface having a second conductive layer, the second conductive layer having a second thickness, the second thickness being greater than the first thickness; one or more power devices embedded within layers of the PCB substrate between the first surface and the second surface; and a plurality of conductive layers arranged within the PCB substrate, the plurality of conductive layers configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly, wherein the first conductive layer of the second substrate has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate, and wherein the first electrical pattern and the second electrical pattern are a three-phase electrical pattern. 12. The circuit board assembly of claim 11 , wherein the cooling assembly comprises:a plurality of vias arranged within the PCB substrate; and a cold plate mounted to the second substrate opposite the second surface of the PCB substrate, wherein the second substrate thermally couples the cold plate to the plurality of conductive layers. 13. The circuit board assembly of claim 12 , wherein the second substrate is an insulated metal substrate such that the first conductive layer and the second conductive layer are made of a metal material. 14. The circuit board assembly of claim 13 , wherein the second conductive layer is a heat sink fin assembly and configured to be mounted to an upper surface of the cold plate. 15. The circuit board assembly of claim 14 , wherein the second conductive layer is mounted to the upper surface of the cold plate via a brazing when the cold plate is made of a metal material or via a plastic aluminum direct bond when the cold plate is made of a plastic material. 16. The circuit board assembly of claim 15 , wherein the first electrical pattern of the second surface of the PCB substrate and the second electrical pattern of the first conductive layer both includes a U, V, W conductive layer architectures that define the three-phase electrical pattern and a P and N conductive layer architectures. 17. The circuit board assembly of claim 12 , wherein the second substrate is a direct bonded aluminum substrate such that the first conductive layer and the second conductive layer are made of an aluminum material. 18. The circuit board assembly of claim 17 , wherein the second conductive layer is a heat sink fin assembly and configured to be mounted to an upper surface of the cold plate. 19. The circuit board assembly of claim 18 , wherein the first electrical pattern of the second surface of the PCB substrate and the second electrical pattern of the first conductive layer both includes a U, V, W conductive layer architectures for the three-phase electrical pattern and a P and N conductive layer architectures. 20. A method of forming a circuit board assembly, the method comprising:arranging one or more power devices within layers of a printed circuit board (PCB) substrate between a first surface and an opposite second surface of the PCB substrate; arranging a plurality of conductive layers within the PCB substrate, the plurality of conductive layers configured to electrically couple the one or more power devices and thermally couple the one or more power devices to a cooling assembly; arranging an intermediate layer sandwiched between the second surface of the PCB substrate and the cooling assembly; and arranging the cooling assembly to couple to the intermediate layer and thermally couple to the second surface of the PCB substrate, wherein the intermediate layer has a first electrical pattern that is similarly patterned to a second electrical pattern of the second surface of the PCB substrate, and wherein the first electrical pattern and the second electrical pattern are a three-phase electrical pattern.
意見反饋
使用該功能遇到問題