The intermediate layer 202 is coupled to the lower layer 218 and the one or more cooling assemblies 200, by various applications, as discussed in greater detail herein. It should be appreciated that the intermediate layer 202 and/or the lower layer 218 electrically isolate electricity from one or more components of the one or more cooling assemblies 200, as discussed in greater detail herein.

In embodiments, one or more PCB material layers 224 may interface between each layer of the PCB substrate 110. That is, one or more PCB material layers 224 may be positioned between each one of the layers of the PCB substrate 110 and between the first surface 112 and the second surface 114 (e.g., between the logic layer 208 and the first power layer 210, between the first power layer 210 and the first core layer 212, between the first core layer 212 and the second core layer 214, and between the second core layer 214 and the lower layer 218). The intermediate layer 202 is coupled to the lower layer 218. Each of the one or more PCB material layers 224 provide both electrical and thermal conduction through the PCB substrate 110. Further, in some embodiments, the one or more PCB material layers 224 may include pre-preg material. As such, the PCB material layers 224 and the plurality of conductive layers 140 of the PCB substrate 110 may be laminated together.