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Driver board assemblies and methods of forming a driver board assembly

專利號(hào)
US11497112B2
公開(kāi)日期
2022-11-08
申請(qǐng)人
Toyota Motor Engineering & Manufacturing North America, Inc.; Toyota Jidosha Kabushiki Kaisha(US TX Plano JP Aichi-Ken)
發(fā)明人
Feng Zhou; Hiroshi Ukegawa; Shohei Nagai
IPC分類
H05K1/02; H05K1/18; H05K3/30; H05K7/20; H05K3/46
技術(shù)領(lǐng)域
pcb,layer,substrate,conductive,layers,assemblies,or,power,board,cooling
地域: TX TX Plano

摘要

A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

說(shuō)明書

Referring still to FIG. 3, the O-conductive layer architecture 316 may include a plurality of O-layers including one or more top O-layers 332, one or more bottom O-layers 334, and a plurality of intermediate O-layers (e.g., intermediate O-layer 336a, 336b). There may be any number of intermediate O-layers between the one or more top O-layers 332 and the one or more bottom O-layers 334. (e.g., one or more O-layers, two or more O-layers, four or more O-layers, etc.).

When arranged in an inverter topology, the O-conductive layer architecture 316 may include U-conductive layer architecture 338a, a V-conductive layer architecture 338b, and a W-conductive layer architecture 338c. For example, the U-conductive layer architecture 338a, the V-conductive layer architecture 338b, and the W-conductive layer architecture 338c may be configured to output one of each phase of an alternating current (i.e., the U-phase, V-phase, and W-phase) to provide an alternating current to, for example, an electric motor. As illustrated the U-conductive layer architecture 338a, V-conductive layer architecture 338b, and W-conductive layer architecture 338c may be substantially identical to one another and positioned parallel to one another.

權(quán)利要求

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