The one or more top O-layers 332 may include a top U-layer 340a, a top V-layer 340b, and a top W-layer 340c. Similarly, the one or more bottom O-layers 334 include a bottom U-layer 342a, a bottom V-layer 342b, and a bottom W-layer 342c. Additionally, each of the plurality of intermediate O-layers includes an intermediate U-layer 344a, an intermediate V-layer 344b, and an intermediate W-layer 344c. Each of the intermediate U-layer 344a, intermediate V-layer 344b, and intermediate W-layer 344c may include any number of layers (e.g., one or more layers, two or more layers, three or more layers, four or more layers, and the like). When laminated together in the PCB substrate 110, each of the U-layers may be electrically and thermally coupled to one another, each of the V-layers may be electrically and thermally coupled to one another, and each of the W-layers may be electrically and thermally coupled to one another. For example, each layer of the O-conductive layer architecture 316 (i.e., each layer of the U-conductive layer architecture 338a, each layer of the V-conductive layer architecture 338b, and each layer of the W-conductive layer architecture 338c) may by in contact with one another (e.g., either directly contacted with one another or in contact through the plurality of vias 206 such as those illustrated in FIG. 2. In some embodiments, each layer of the plurality of conductive layers 140 may include an O-layer. In some embodiments, only some of the conductive layers 140 may include an O-layer. The O-conductive layer architecture 316 is connected to and/or defines the one or more O-terminals 120. For example, the one or more O-terminals 120 may include a U-terminal 120a (defined by and/or connected to the U-conductive layer architecture 338a), a V-terminal 120b (defined by and/or connected to the V-conductive layer architecture 338b), and a W-terminal 120c (defined by and/or connected to the W-conductive layer architecture 338c. Additionally, each of the U-conductive layer architecture 338a, V-conductive layer architecture 338b, and W-conductive layer architecture 338c are separate and distinct from one another to allow alternating current to be delivered via the U-conductive layer architecture 338a, V-conductive layer architecture 338b, and W-conductive layer architecture 338c to the corresponding U-terminal 120a, the V-terminal 120b, and the W-terminal 120c.