Driver board assemblies and methods of forming a driver board assembly
摘要
說(shuō)明書(shū)
In yet another aspect, a method of forming a circuit board assembly is provided. The method includes arranging one or more power devices between a first surface and an opposite second surface of a printed circuit board (PCB) substrate and arranging a plurality of conductive layers within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to a cooling assembly. The method continues by arranging an intermediate layer sandwiched between the second surface of the PCB substrate and the cooling assembly and arranging the cooling assembly to couple to the intermediate layer and thermally couple to the second surface of the PCB substrate. The intermediate layer has a first electrical pattern that is similarly patterned to a second electrical pattern of the second surface of the PCB substrate.
These and additional features provided by the embodiments described herein will be more fully understood in view of the following detailed description, in conjunction with the drawings.
The embodiments set forth in the drawings are illustrative and exemplary in nature and not intended to limit the subject matter defined by the claims. The following detailed description of the illustrative embodiments can be understood when read in conjunction with the following drawings, where like structure is indicated with like reference numerals and in which:
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