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Imaging apparatus

專利號
US11516373B2
公開日期
2022-11-29
申請人
Panasonic Intellectual Property Management Co., Ltd.(JP Osaka)
發(fā)明人
Takuya Amano
IPC分類
H04N5/225
技術(shù)領(lǐng)域
image,duct,sensor,imaging,radiator,18a,heat,in,member,subframe
地域: Osaka

摘要

An imaging apparatus includes: a lens attachment portion to which a lens is attached; an image sensor on which light transmitted through a lens attached to the lens attachment portion is incident; a heat transfer members configured to support the image sensor and to absorb heat of the image sensor; a main frame including a duct in which outside air flows and provided with a through hole through which a part of the heat transfer member passes; a fan arranged in the duct; a front frames configured to support the lens attachment portion and the heat transfer members and to be attached to the main frame; and a seal member configured to block a flow of outside air from inside the duct toward the image sensor through the through hole.

說明書

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In order to solve the above problem, according to one aspect of the present disclosure, provided is an imaging apparatus including: a lens attachment portion to which a lens is attached; an image sensor on which light transmitted through a lens attached to the lens attachment portion is incident; a heat transfer member configured to support the image sensor and to absorb heat of the image sensor; a main frame including a duct in which outside air flows and provided with a through hole through which a part of the heat transfer member passes; a fan arranged in the duct; a front frame configured to support the lens attachment portion and the heat transfer member and to be attached to the main frame; and a seal member configured to block a flow of outside air from inside the duct toward the image sensor through the through hole.

Effect of the Invention

According to the present disclosure, in the imaging apparatus that cools the image sensor using the outside air, it is possible to prevent the foreign matter such as dust included in the outside air from reaching the image sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an imaging apparatus according to one embodiment of the present disclosure;

FIG. 2 is a perspective view of a subassembly of an imaging apparatus including components related to cooling of an image sensor;

FIG. 3A is an exploded perspective view of the subassembly shown in FIG. 2;

權(quán)利要求

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