This application claims the priority benefit of Taiwan application serial No. 108121131 filed on Jun. 18, 2019. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.

The disclosure relates to a speaker, and in particular, to a speaker including a heat dissipation structure.

With the rapid development of electronic technologies, there are various types of multimedia electronic devices such as notebooks, personal computers (PCs), mobile phones, and personal digital assistants (PDAs). As people receive information from the outside world mainly via visual sense and auditory sense, such multimedia electronic devices—a display or a speaker—are equipped with electronic devices to provide visual and audio information to users.

However, as multimedia electronic devices are developing toward a lightweight and thin structure, the volume for occupying a speaker and the space for heat dissipation of a speaker become smaller. Consequently, a large amount of heat accumulates during the continuous operation of the speaker would damage it.