FIGS. 4a, 4b, 4c, and 4d show techniques for distributing two differential signal conductors to the replicated traces shown at FIGS. 2b and 3b. Today, most integrated circuits, chipsets, hubs, and the like, that provide an interface using differential signaling, generates a single complementary signal pair. Therefore, some means to distribute the two signals to corresponding replicated conductor traces is required. In the future, this particular requirement may be eliminated by dedicating individual interface pins for each of the discreet replicated signals. FIG. 4a shows a perspective view of a PCB including ball grid array (BGA) terminals 410 and 412 that provide a differential signal interface from an integrated circuit package to a printed circuit board. Conductor trace 411 electrically couples a first complementary differential signal (indicated by a “+” sign) from BGA terminal 410 to a PCB via 420. Vias 424 further propagate the first signal to traces 230, 232, and 234 a lower layer of the PCB. Conductor trace 413 electrically couples a second complementary differential signal (indicated by a “?” sign) from BGA terminal 412 to a PCB via 422, which distributes the second signal to traces 231, 233, and 235 at the same layer of the PCB as traces 230, 232, and 234.