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Method to improve PCB trace conductivity and system therefor

專利號(hào)
US11516905B2
公開日期
2022-11-29
申請(qǐng)人
DELL PRODUCTS, LP(US TX Round Rock)
發(fā)明人
Sandor Farkas; Bhyrav Mutnury
IPC分類
H05K1/02; H01L23/64; H01L23/528; H05K3/40
技術(shù)領(lǐng)域
conductor,traces,trace,signal,handling,or,pcb,system,mils,conductors
地域: TX TX Round Rock

摘要

A method may include receiving a first and a second complementary signal to provide differential signaling. The method may further include providing a first conductor trace to transport the first complementary signal; providing a second conductor trace to transport the second complementary signal, the second conductor trace immediately adjacent to the first conductor trace; providing a third conductor trace to transport the first complementary signal, the third conductor trace immediately adjacent to the second conductor trace; and providing a fourth conductor trace to transport the second complementary signal, the fourth conductor trace immediately adjacent to the third conductor trace.

說明書

A method may include receiving a first and a second complementary signal to provide differential signaling. The method may further include providing a first conductor trace to transport the first complementary signal; providing a second conductor trace to transport the second complementary signal, the second conductor trace immediately adjacent to the first conductor trace; providing a third conductor trace to transport the first complementary signal, the third conductor trace immediately adjacent to the second conductor trace; and providing a fourth conductor trace to transport the second complementary signal, the fourth conductor trace immediately adjacent to the third conductor trace.

BRIEF DESCRIPTION OF THE DRAWINGS

It will be appreciated that for simplicity and clarity of illustration, elements illustrated in the Figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to other elements. Embodiments incorporating teachings of the present disclosure are shown and described with respect to the drawings presented herein, in which:

FIG. 1 is a block diagram of an information handling system according to a specific embodiment of the present disclosure;

FIGS. 2a and 2b are block diagrams illustrating traces at a printed circuit board for conducting high frequency differential signals according to a specific embodiment of the present disclosure;

FIGS. 3a and 3b are block diagrams illustrating skin effect at conductor traces of a printed circuit board according to a specific embodiment of the present disclosure;

權(quán)利要求

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