This application claims the benefit under 35 U.S.C. § 119(a) of Korean Patent Application No. 10-2020-0098917 filed on Aug. 7, 2020 in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes.

The following description relates to an electronic device module.

There has been increased demand for portable electronic products in the electronic products market. To meet such demand, electronic devices mounted on such portable electronic products have been required to have a reduced size and weight.

To reduce the size and weight of such electronic devices, a technique of reducing a size of an individual mounting component, a system on chip (SOC) technique for configuring a plurality of individual devices on a single chip, and a system in package (SIP) technique for integrating a plurality of individual devices as a single package have been continuously studied.

In particular, a high frequency electronic device module, such as a communication module or a network module, which uses a high frequency signal, may generate a large amount of heat during operations thereof as a frequency band increases. In this regard, there has been demand for an electronic device module capable of effectively releasing heat.