To prevent such a problem and in consideration of mounting variations of the heat radiating portion, a lateral distance G (FIG. 2) between the side surface of the exothermic device 1a and the side surface of the heat radiating portion 30 may be 150 μm or more. However, the electronic device module 100 is not limited to the foregoing example. In a case in which the mounting height of the general device 1b is less than the mounting height of the exothermic device 1a, at least a portion of the heat radiating portion 30 may be configured to protrude laterally outside of the exothermic device 1a.

In a case in which the surface area of the lower surface of the heat radiating portion 30 is excessively small, it may be difficult to transfer heat of the exothermic device 1a to the heat radiating portion 30. Accordingly, the surface area of the lower surface of the heat radiating portion 30 of the example embodiment may be formed to be 50% or more of the surface area of the upper surface of the exothermic device 1a.

An exposed surface of the heat radiating portion 30, which is exposed to an outside of the sealing portion 40 may be disposed on a same plane as the surface of the sealing portion 40 in which the exposed surface of the heat radiating portion 30 is disposed. Accordingly, the exposed surface of the heat radiating portion 30 and the surface of the sealing portion may be formed to be flat.