In addition, the heat radiating portion 30 is connected to the shielding layer 50 and thus may release heat through the shielding portion 70, thereby increasing a heat radiating effect.

FIG. 8 is a cross-sectional view illustrating an electronic device module 700, according to an embodiment.

Referring to FIG. 8, the electronic device module 700 is configured similarly to the electronic device module 600 illustrated in FIG. 7, and but includes an electronic component 1d and a sealing portion 40-2.

The sealing portion 40-2 is partially disposed on the first surface of a substrate 10. The electronic component 1d is disposed outside of the sealing portion 40-2. For example, the electronic component 1d is disposed outside of an external sealing portion 40b-1 of the sealing portion 40-2.

The electronic component 1d may include a connector to which an FPCB or a cable is connected. In this regard, the electronic device module 700 may be electrically connected to outside through the electronic component 1d, rather than through a connection terminal. However, the disclosure is not limited to the foregoing configuration. The electronic component 1d may include an antenna device or other active and passive devices.

Alternately, the electronic device module 700 may include an antenna 20 on one surface or inside of the substrate 10.