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Electronic device module

專利號
US11528800B2
公開日期
2022-12-13
申請人
Samsung Electro-Mechanics Co., Ltd.(KR Suwon-si)
發(fā)明人
Seok Yoon Hong; Han Su Park; Hyuk Ki Kwon
IPC分類
H05K1/00; H05K1/02; H01Q9/16; H01Q1/02; H01Q9/04
技術領域
radiating,portion,shielding,heat,sealing,surface,exothermic,electronic,device,may
地域: Suwon-si

摘要

An electronic device module includes: a substrate; a sealing portion disposed on a first surface of the substrate; an exothermic device disposed on the first surface of the substrate and embedded in the sealing portion; and a heat radiating portion at least partially embedded in the sealing portion. A lower surface of the heat radiating portion is bonded to one surface of the exothermic device. A side surface of the heat radiating portion is curved and is entirely in contact with the sealing portion. A plurality of grooves are disposed in the side surface of the heat radiating portion.

說明書

While this disclosure includes specific examples, it will be apparent after an understanding of the disclosure of this application that various changes in form and details may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only, and not for purposes of limitation. Descriptions of features or aspects in each example are to be considered as being applicable to similar features or aspects in other examples. Suitable results may be achieved if the described techniques are performed in a different order, and/or if components in a described system, architecture, device, or circuit are combined in a different manner, and/or replaced or supplemented by other components or their equivalents. Therefore, the scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are to be construed as being included in the disclosure.

權利要求

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