A surface area of the lower surface of the heat radiating portion may be smaller than the surface area of the one surface of the exothermic device.

The side surface of the heat radiating portion may include a first side surface portion formed to have an arch shape and a second side surface portion having a ridge and a valley repeatedly disposed therein.

The electronic device module may further include a bonding layer disposed between the exothermic device and the heat radiating portion and bonding the exothermic device to the heat radiating portion.

The electronic device module may further include an electronic component mounted on the substrate in a position adjacent to the exothermic device. A mounting height of the electronic component may be greater than a mounting height of the exothermic device.

The electronic device module may further include an electronic component mounted on the first surface of the substrate and disposed outside of the sealing portion.

The electronic device may further include an antenna disposed inside the substrate or on a second surface of the substrate.

The antenna may include a patch antenna disposed in a region opposing the sealing portion.

The antenna may include a dipole antenna disposed in a region not opposing the sealing portion.

The electronic device module may further include a shielding layer disposed on a surface of the sealing portion and configured to shield an electromagnetic wave. One surface of the heat radiating portion may be bonded to the shielding layer.

The electronic device module may further include a shielding wall disposed inside the sealing portion and electrically connecting the substrate to the shielding layer.