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Electronic device module

專利號(hào)
US11528800B2
公開日期
2022-12-13
申請(qǐng)人
Samsung Electro-Mechanics Co., Ltd.（KR Suwon-si）
發(fā)明人
Seok Yoon Hong; Han Su Park; Hyuk Ki Kwon
IPC分類
H05K1/00; H05K1/02; H01Q9/16; H01Q1/02; H01Q9/04
技術(shù)領(lǐng)域
radiating,portion,shielding,heat,sealing,surface,exothermic,electronic,device,may
地域： Suwon-si

摘要

An electronic device module includes: a substrate; a sealing portion disposed on a first surface of the substrate; an exothermic device disposed on the first surface of the substrate and embedded in the sealing portion; and a heat radiating portion at least partially embedded in the sealing portion. A lower surface of the heat radiating portion is bonded to one surface of the exothermic device. A side surface of the heat radiating portion is curved and is entirely in contact with the sealing portion. A plurality of grooves are disposed in the side surface of the heat radiating portion.

說明書

In another general aspect, an electronic device module includes: a substrate; a sealing portion disposed on a first surface of the substrate; an exothermic device disposed on the first surface of the substrate and embedded in the sealing portion; and a heat radiating portion at least partially embedded in the sealing portion and having a lower surface bonded to one surface of the exothermic device. An entire interface between the heat radiating portion and the sealing portion is curved. A side surface of the heat radiating device and a side surface of the exothermic device are laterally spaced apart from each other by 150 μm or more.

The heat radiating portion may include an upper surface having a same shape as the lower surface of the heat radiating portion.

Other features and aspects will be apparent from the following detailed description, the drawings, and the claims.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective diagram illustrating an electronic device module, according to an embodiment.

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1.

FIG. 3 is a cross-sectional view schematically illustrating an electronic device module, according to an embodiment.

FIGS. 4 to 6 are perspective diagrams illustrating electronic device modules, according to embodiments.

FIG. 7 is a cross-sectional view schematically illustrating an electronic device module, according to an embodiment.

權(quán)利要求

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