Printed circuit board
地域：
Suwon-si
摘要
A printed circuit board includes: an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer, and the first circuit layer includes a first region embedded in the insulating layer, and a second region protruding from the upper surface of the insulating layer.
說明書
This application claims benefit of priority to Korean Patent Application No. 10-2020-0125666 filed on Sep. 28, 2020 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.
The present disclosure relates to a printed circuit board, in particular, to a printed circuit board including a circuit layer having a partially embedded structure.
Recently, as the field of application of electronic devices including mobile products has been diversified, it is become necessary to process large-capacity, high-definition information at a high speed, and to reduce the weight of devices. Accordingly, a technology is being developed to reduce the thickness of products and to increase the production efficiency of high value-added products.
An aspect of the present disclosure is to provide a printed circuit board in which a seed layer on a circuit layer is removed through a blasting method.
Another aspect of the present disclosure is to provide a printed circuit board having a circuit pattern of a partially embedded structure of a new type, different from the conventional structure.
Another aspect of the present disclosure is to provide a printed circuit board having improved bonding strength with a solder.
Another aspect of the present disclosure is to provide a printed circuit board having improved process efficiency during manufacturing by eliminating a pretreatment process of a solder resist layer.
權(quán)利要求
What is claimed is:1. A printed circuit board, comprising:an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer, wherein the first circuit layer comprises a first region embedded in the insulating layer and a second region protruding from the upper surface of the insulating layer, wherein an upper surface of the first circuit layer has roughness, and wherein a first portion of a side surface of the first circuit layer in the second region has a relatively greater roughness than a second portion of the side surface in the second region farther from the upper surface of the first circuit layer than the first portion. 2. The printed circuit board of claim 1 , wherein a lower surface and a side surface of the first circuit layer in the first region are in contact with the insulating layer, respectively, and an upper surface and the side surface of the first circuit layer in the second region are exposed from the insulating layer, respectively. 3. The printed circuit board of claim 1 , wherein the first circuit layer is composed of a single layer. 4. The printed circuit board of claim 3 , wherein the first circuit layer is composed of one plating layer without a seed layer. 5. The printed circuit board of claim 1 , wherein the roughness of the upper surface of the first circuit layer is relatively greater than roughness of the side surface of the first circuit layer. 6. The printed circuit board of claim 1 , wherein a region of the upper surface of the insulating layer, exposed by the first circuit layer, has roughness. 7. The printed circuit board of claim 1 , further comprising a plurality of inner circuit layers embedded inside the insulating layer; anda second circuit layer disposed on a lower surface of the insulating layer. 8. The printed circuit board of claim 1 , further comprising a solder disposed on at least a portion of the first circuit layer. 9. The printed circuit board of claim 1 , further comprising a via embedded in the insulating layer and extending from the first circuit layer,a width of the via increases in a direction from the upper surface of the insulating layer to a lower surface of the insulating layer. 10. A printed circuit board, comprising:an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer, wherein roughness of an upper surface of the first circuit layer is relatively greater than roughness of a side surface of the first circuit layer, wherein a first portion of the side surface of the first circuit layer has a relatively greater roughness than a second portion of the side surface of the first circuit layer, and wherein the second portion is farther from the upper surface of the first circuit layer than the first portion. 11. The printed circuit board of claim 10 , wherein roughness of a region of the upper surface of the insulating layer, exposed by the first circuit layer, is relatively greater than roughness of a lower surface of the insulating layer. 12. The printed circuit board of claim 10 , wherein the first circuit layer comprises a first region embedded in the insulating layer and a second region protruding from the upper surface of the insulating layer. 13. The printed circuit board of claim 10 , wherein the upper surface of the insulating layer has a recess portion, andthe first circuit layer is disposed in a region except for the recess portion of the upper surface of the insulating layer. 14. The printed circuit board of claim 13 , wherein a lower surface and a side surface of the recess portion have roughness, andthe roughness of the lower surface of the recess portion is relatively greater than the roughness of the side surface of the recess portion. 15. The printed circuit board of claim 10 , further comprising a plurality of inner circuit layers embedded inside the insulating layer; anda second circuit layer disposed on a lower surface of the insulating layer. 16. The printed circuit board of claim 10 , further comprising a via embedded in the insulating layer and extending from the first circuit layer,a width of the via increases in a direction from the upper surface of the insulating layer to a lower surface of the insulating layer. 17. A printed circuit board, comprising:an insulating layer; and a circuit layer disposed on an upper surface of the insulating layer and including at least a portion protruding from the upper surface, wherein an upper surface of the at least a portion of the circuit layer has roughness, wherein a first portion of a side surface of the at least a portion of the circuit layer has a relatively greater roughness than a second portion of the side surface of the at least a portion of the circuit layer, and wherein the second portion is farther from the upper surface of the at least a portion of the circuit layer than the first portion. 18. The printed circuit board of claim 17 , wherein patterns of the circuit layer comprise at least a portion protruding from the upper surface of the insulating layer. 19. The printed circuit board of claim 18 , wherein the patterns of the circuit layer each comprise another portion embedded in the insulating layer. 20. The printed circuit board of claim 18 , wherein surface roughness of the portion of one of the patterns protruding from the upper surface of the insulating layer is greater than surface roughness of the portion of the one of the patterns embedded in the insulating layer. 21. The printed circuit board of claim 17 , further comprising a solder disposed on at least a portion of the circuit layer. 22. The printed circuit board of claim 17 , further comprising a via embedded in the insulating layer and extending from the circuit layer,a width of the via increases in a direction from the upper surface of the insulating layer to a lower surface of the insulating layer.
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