Referring to FIG. 10, second upper holes 155b spaced apart from the first upper holes 145b may be further formed in the circuit film 140. The second upper holes 155b may be connected to the second lower holes 155a. The second upper holes 155b may be formed to be spaced apart from each other. Radiuses of the second upper holes 155b may be greater than the radiuses of the second lower holes 155a. The first upper holes 145b and the second upper holes 155b may form second openings 30 on the upper surface of the circuit film 140. In an embodiment, the anisotropic conductive film 120 may fill the first lower holes 145a, the second lower holes 155a, the first upper holes 145b, and the second upper holes 155b. In an embodiment, the vernier-key 15 may be formed on the edges of the first upper holes 145b, and the vernier-key 15 may be formed on edges of the second upper holes 155b. In the display device 1000, the compressive force may be analyzed through the vernier-key 15 without additional inspection. However, in order to prevent poor attachment in the display device 1000, holes may be further formed in the circuit film 140.

FIGS. 11A to 11E are schematic diagrams illustrating a method of manufacturing a display device.

Referring to FIGS. 1 and 11A, the substrate 100 including the display area DA and the non-display area NDA may be prepared.