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Display device and method of manufacturing the same

專利號
US11528805B2
公開日期
2022-12-13
申請人
Samsung Display Co., LTD.（KR Yongin-si）
發(fā)明人
Chang Woo Byun; Jong Woo Park; Shangu Kim; Young Tae Choi
IPC分類
H05K1/11; H05K3/32; G02F1/1345; H01R12/62
技術(shù)領(lǐng)域
holes,film,pads,upper,145b,145a,may,circuit,conductive,lower
地域： Yongin-si

摘要

A display device includes a substrate including a display area and a non-display area adjacent to the display area, lower pads disposed in the non-display area of the substrate and spaced apart from each other, upper pads disposed on the lower pads and spaced apart from each other, an anisotropic conductive film disposed between the lower pads and the upper pads, and a circuit film disposed on the upper pads, the circuit film including first lower holes disposed between the upper pads in a plan view, and first upper holes connected to the first lower holes and having radiuses larger than radiuses of the first lower holes. The first upper holes form first openings on an upper surface of the circuit film. A method of manufacturing the display device is provided.

說明書

The first upper holes 145b and the first lower holes 145a may be formed by etching the circuit film 140. In an embodiment, the first lower holes 145a and the first upper holes 145b may be formed by a wet etching method. In another embodiment, the first lower holes 145a and the first upper holes 145b may be formed by a dry etching method. In still another embodiment, the first lower holes 145a and the first upper holes 145b may be formed by applying a physical force. For example, the first lower holes 145a and the first upper holes 145b may be formed by a punching method.

As illustrated in FIG. 5, when the holes 147 having inverted trapezoidal cross-sectional shapes are formed in the circuit film 140, each of the holes 147 may be formed at one time.

權(quán)利要求

1
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