白丝美女被狂躁免费视频网站,500av导航大全精品,yw.193.cnc爆乳尤物未满,97se亚洲综合色区,аⅴ天堂中文在线网官网

Adhesive layered backflow preventer

專利號
US11533827B2
公開日期
2022-12-20
申請人
Western Digital Technologies, Inc.(US CA San Jose)
發(fā)明人
Carson Belknap; Jeff Wilke
IPC分類
H05K7/20
技術(shù)領(lǐng)域
backflow,preventer,flaps,adhesive,204n,layer,fan,sled,in,204a
地域: CA CA San Jose

摘要

An adhesive layered backflow preventer laminate, for use in impeding airflow from flowing in a backflow direction through the backflow preventer and a corresponding cooling fan, includes a thin front support layer adhered to a thin backflow flap layer, having a plurality of backflow flaps, which is adhered to a thin rear support layer. Each of the structural layers is adhered to the adjacent structural layer using a respective double-sided adhesive layer, by way of a manufacturing process that avoids the use of costly injection molded parts and machined plastic parts and metal components such as springs and hinges.

說明書

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
FIELD OF EMBODIMENTS

Embodiments of the invention may relate generally to data storage systems, and particularly to an adhesive layered backflow preventer for such a rack mounted system.

BACKGROUND

As networked computer systems grow in numbers and capability, there is a need for more storage system capacity. Cloud computing and large-scale data processing further increase the need for digital data storage systems that are capable of transferring and holding significant amounts of data. Data centers typically include many rack-mountable storage units that are used to store the large amounts of data.

One approach to providing sufficient data storage in data centers is the use of arrays of data storage devices. Many data storage devices can be housed in an electronics enclosure (sometimes referred to as a “rack”), which is typically a modular unit that can hold and operate independent data storage devices in an array, computer processors, routers and other electronic equipment. The data storage devices are mounted in close proximity to each other within the electronics enclosure, so that many data storage devices can fit into a defined volume. Operating many data storage devices within close proximity within the electronics enclosure can create heat issues, which can in turn lead to premature failure of the data storage devices.

權(quán)利要求

1
What is claimed is:1. A layered backflow preventer assembly comprising:a front support layer having a proximal side and a distal side;a first adhesive layer adhered to the distal side of the front support layer;a backflow flap layer adhered to a distal side of the first adhesive layer and comprising one or more backflow flaps hinged to rotate in a proximal direction in a normal state;a second adhesive layer adhered to a distal side of the backflow flap layer;a rear support layer adhered to a distal side of the second adhesive layer; anda third adhesive layer adhered to a distal side of the rear support layer;wherein the front support layer and the first adhesive layer are shaped with a substantially same profile, each including one or more through-holes configured to permit proximal rotation of the backflow flaps through the through-holes of the front support layer and the first adhesive layer.2. The backflow preventer assembly of claim 1, wherein the one or more backflow flaps are hinged to rotate in only the proximal direction in a normal state.3. The backflow preventer assembly of claim 1, wherein the one or more backflow flaps are constrained from rotating in a distal direction.4. The backflow preventer assembly of claim 1, wherein the rear support layer comprises means for permitting airflow through the rear support layer while constraining rotation in a distal direction of the one or more backflow flaps.5. The backflow preventer assembly of claim 1, wherein the backflow preventer assembly is devoid of injection molded parts and machined plastic parts.6. The backflow preventer assembly of claim 1, wherein the backflow preventer assembly is devoid of metal parts.7. The backflow preventer assembly of claim 1, wherein the one or more backflow flaps are positioned adjacently in pairs and circumferentially about a central support hub and are configured for hingedly rotating in a circumferential direction in a normal state of airflow.8. The backflow preventer assembly of claim 1, wherein the one or more backflow flaps are positioned adjacently and circumferentially about a central support hub, and are configured for hingedly rotating in a radial direction in a normal state of airflow.9. A data storage system comprising:a system enclosure; anda backflow preventer laminate enclosed within the system enclosure and configured to prevent backflow air currents within the system enclosure, the backflow preventer laminate comprising:a front support layer having a proximal side and a distal side,a first adhesive layer adhered to the distal side of the front support layer,a backflow flap layer adhered to a distal side of the first adhesive layer and comprising one or more backflow flaps hinged to rotate in a proximal direction in a normal state,a second adhesive layer adhered to a distal side of the backflow flap layer,a rear support layer adhered to a distal side of the second adhesive layer, anda third adhesive layer adhered to a distal side of the rear support layer;wherein the front support layer and the first adhesive layer are shaped with a substantially same profile, including one or more through-holes configured to permit proximal rotation of the backflow flaps through the through-holes of the front support layer and the first adhesive layer.10. The data storage system of claim 9, further comprising:a cooling fan enclosed within the system enclosure and comprising a fan housing; andwherein a distal side of the third adhesive layer of the backflow preventer laminate is further adhered to a proximal side of the fan housing.11. The data storage system of claim 9, further comprising:a plurality of data storage devices enclosed within the system enclosure; anda cooling fan enclosed within the system enclosure between the plurality of data storage devices and the backflow preventer laminate.12. The data storage system of claim 9, further comprising:a plurality of data storage devices enclosed within the system enclosure;a plurality of cooling fans enclosed within the system enclosure, each cooling fan comprising a fan housing; anda plurality of the backflow preventer laminates;wherein a distal side of the third adhesive layer of each of the plurality of backflow preventer laminates is adhered to a proximal side of a corresponding fan housing of a corresponding cooling fan of the plurality of cooling fans.13. The data storage system of claim 9, wherein the one or more backflow flaps of the backflow flap layer of the backflow preventer laminate are hinged to rotate in only the proximal direction in a normal state.14. The data storage system of claim 9, wherein each of the backflow flaps is constrained from rotating in a distal direction.15. The data storage system of claim 9, wherein the rear support layer of the backflow preventer laminate comprises a plurality of airflow through-holes separated by crossbars in a grate-like configuration to permit airflow through the through-holes of the rear support layer.16. A method of manufacturing a backflow preventer laminate assembly, the method comprising:adhering a distal side of a front support part to a proximal side of a backflow flap part with a double-sided first adhesive layer, wherein the backflow flap part comprises one or more backflow flaps hinged to rotate in a proximal direction in a normal state, and the front support part and the first adhesive layer are shaped with a substantially same profile including one or more through-holes configured to permit proximal rotation of the backflow flaps through the through-holes of the front support part and the first adhesive layer; andadhering a distal side of the backflow flap part to a proximal side of a rear support part with a double-sided second adhesive layer.17. The method of claim 16, further comprising:adhering a distal side of the rear support part to a proximal side of a cooling fan housing with a double-sided third adhesive layer.18. The method of claim 17, wherein adhering with the third adhesive layer includes aligning airflow through-holes of the rear support part with one or more through-holes of the third adhesive layer to allow airflow through the through-holes of the rear support part.19. The method of claim 16, wherein adhering with the first adhesive layer includes aligning the one or more through-holes of the front support part, the corresponding one or more through-holes of the first adhesive layer, and the corresponding backflow flaps to permit rotation of the aligned backflow flaps through the aligned through-holes of the front support part and the first adhesive layer.20. The method of claim 16, wherein the front support part, the backflow flap part, and the rear support part are composed of a plastic material.
微信群二維碼
意見反饋