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Adhesive layered backflow preventer

專利號
US11533827B2
公開日期
2022-12-20
申請人
Western Digital Technologies, Inc.(US CA San Jose)
發(fā)明人
Carson Belknap; Jeff Wilke
IPC分類
H05K7/20
技術領域
backflow,preventer,flaps,adhesive,204n,layer,fan,sled,in,204a
地域: CA CA San Jose

摘要

An adhesive layered backflow preventer laminate, for use in impeding airflow from flowing in a backflow direction through the backflow preventer and a corresponding cooling fan, includes a thin front support layer adhered to a thin backflow flap layer, having a plurality of backflow flaps, which is adhered to a thin rear support layer. Each of the structural layers is adhered to the adjacent structural layer using a respective double-sided adhesive layer, by way of a manufacturing process that avoids the use of costly injection molded parts and machined plastic parts and metal components such as springs and hinges.

說明書

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According to an embodiment, a distal side of the third adhesive layer 207 may be further adhered to a proximal side of a fan housing 112a of a cooling fan 112 or fan assembly. Thus, what is described is an adhesive layered backflow preventer 200 that is manufactured, assembled, composed in such a way to be devoid of any relatively costly injection molded and/or machined plastic parts, and devoid of metal components such as springs and/or hinges, by way of assembling a series of relatively or substantially two-dimensional profiles (e.g., alternating plastic and adhesive layers) rather than a set of complex parts.

Alternative Adhesive Layered Backflow Preventer Configurations

權利要求

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