Hot surfaces, such as small electronic and photoelectronic components can be cooled by applying a cooling liquid to the hot surface. When the surface is significantly hotter than the liquid's boiling point, the applied liquid produces an insulating vapor layer on the hot surface that keeps the liquid from boiling rapidly. The bottom portion of the liquid vaporizes upon contact with the hot surface at temperatures above the Leidenfrost point. Because of this repulsive effect, the liquid droplet hovers over the hot surface rather than making contact with the hot surface, which retards heat transport and prevents proper cooling because the vapor has a lower thermal conductivity than the liquid. This phenomenon is called the Leidenfrost Effect.

The Leidenfrost point of a liquid on a hot surface depends on many factors, including the type of liquid, impurities, and hot surface properties. For water on a hot pan, the Leidenfrost effect occurs as the temperature exceeds about 193° C.

Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A non-limiting example of a cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the fluid is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component, a photoelectronic component, or a combination thereof.