The dimensions of the openings 410 in the mesh 409 have dimensions that vary and depend on the size of the droplet 112. According to some aspects, the openings 410 have a diameter that is equal to the diameter of the droplet (d2) divided by 10 (d2/10). Although the openings 410 in the mesh 409 are shown as being regularly spaced on the hot surface 404, the openings 410 do not have to be regularly spaced and are irregularly spaced in some aspects. The mesh 409 must be elevated above the hot surface 202 below in order for vapor from the vapor layer 114 to escape.

The mesh 409 can be separately formed and then arranged on or adhered to the hot surface 404, or the mesh 409 can be formed directly on the hot surface 404 by forming openings 410 in a layer of material arranged on the hot surface 404.

Methods of making modified hot surfaces, as shown in FIGS. 1A-4B, include adding three-dimensional surface topography to the hot surfaces, which allows the cooling droplets to force the vapor layer into the surface features. The three-dimensional surface topography can be a plurality of pillars with a plurality of trenches therebetween, or a mesh with a plurality of openings or trenches, for example. The hot surface is part of a small electronic component, such as a processor or chip, or a photoelectronic component, such as an IR detector. Depending on the type of device/application, the surface includes one or more materials, for example, a semiconductor, a metal, or a combination thereof.