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Electronic cooling systems

專利號(hào)
US11533828B2
公開日期
2022-12-20
申請(qǐng)人
RAYTHEON COMPANY(US MA Waltham)
發(fā)明人
Delmar L. Barker; Paul M. Lyons
IPC分類
H05K7/20; F25B9/02
技術(shù)領(lǐng)域
hot,pillars,droplet,trenches,surface,vapor,cooling,coolant,or,layer
地域: MA MA Waltham

摘要

Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.

說明書

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Another non-limiting example of a cooling system includes a compression container that includes a coolant. The coolant includes a fluid. The cooling system includes a valve arranged on the compression container through which the fluid is released from the compression container. The cooling system further includes a component positioned to receive droplets from the fluid. The component has a surface with a three-dimensional topography that includes a mesh with a plurality of openings. The component is an electronic component, a photoelectronic component, or a combination thereof.

A non-limiting example of cooling a component includes opening a valve of a compression container that includes a coolant. The coolant includes a fluid. Droplets of the coolant are applied to a surface of the component. The surface has a three-dimensional topography, and the component is an electronic component, a photoelectronic component, or a combination thereof.

Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

For a more complete understanding of this disclosure, reference is now made to the following brief description, taken in connection with the accompanying drawings and detailed description, wherein like reference numerals represent like parts:

FIG. 1A is a schematic diagram that illustrates a system for cooling according to aspects of the present invention;

權(quán)利要求

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