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Electronic cooling systems

專利號
US11533828B2
公開日期
2022-12-20
申請人
RAYTHEON COMPANY（US MA Waltham）
發(fā)明人
Delmar L. Barker; Paul M. Lyons
IPC分類
H05K7/20; F25B9/02
技術領域
hot,pillars,droplet,trenches,surface,vapor,cooling,coolant,or,layer
地域： MA MA Waltham

摘要

Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.

說明書

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

FIG. 1B is a schematic diagram showing an expanded side view of a droplet on the hot surface in FIG. 1A;

FIG. 2 is a schematic diagram that illustrates a side view of a droplet on a hot surface with a plurality of pillars according to aspects of the present invention;

FIG. 3 is a schematic diagram that illustrates a perspective view of a hot surface with a plurality of pillars and an intermediate mesh according to aspects of the present invention;

FIG. 4A is a schematic diagram that illustrates a perspective view of a hot surface with a mesh arranged on the surface according to aspects of the present invention; and

FIG. 4B is a schematic diagram showing an expanded side view of a droplet on the hot surface of FIG. 4A.

DETAILED DESCRIPTION

權利要求

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