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Electronic cooling systems

專利號
US11533828B2
公開日期
2022-12-20
申請人
RAYTHEON COMPANY(US MA Waltham)
發(fā)明人
Delmar L. Barker; Paul M. Lyons
IPC分類
H05K7/20; F25B9/02
技術領域
hot,pillars,droplet,trenches,surface,vapor,cooling,coolant,or,layer
地域: MA MA Waltham

摘要

Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.

說明書

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In order to cool components, such as electronics and photoelectronic components, a higher Leidenfrost point is desirable, which would allow liquid droplets to come into direct contact with the hot surface. Described herein are cooling systems and methods that use modified surfaces that eliminate or mitigate the Leidenfrost effect so that Joule-Thomson cooling is more efficient. The systems and methods include forcing a liquid and/or a real gas (e.g., nitrogen and/or argon) through a valve while keeping it insulated so that no heat is exchanged with the environment, which result in a change in temperature called the Joule-Thomson effect. The mixed phase of vapor and liquid droplets are applied to a hot surface that includes three-dimensional topography with macroscopic or microscopic features on the surface, such as a plurality of pillars and trenches. The surface features allow the vapor layer that is formed on the hot surface to move through the features, horizontally across the hot surface, which lowers the surface liquid closer to the surface for faster cooling.

FIG. 1A is a schematic diagram that illustrates a cooling system 100 and method for cooling according to aspects of the present invention. The system 100 includes a compression container 102 of a coolant 103 within. The coolant 103 includes a fluid, which can be a fluid mixture.

The coolant 103 includes a pressurized liquid or a compressed gas, or a mixture thereof. Non-limiting examples of liquids and/or compressed gases include nitrogen (N2), argon, krypton, or an engineered refrigerant, for example, a hydrochlorofluorocarbon (e.g., R22 or R134A).

權利要求

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