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Electronic cooling systems

專利號
US11533828B2
公開日期
2022-12-20
申請人
RAYTHEON COMPANY(US MA Waltham)
發(fā)明人
Delmar L. Barker; Paul M. Lyons
IPC分類
H05K7/20; F25B9/02
技術(shù)領(lǐng)域
hot,pillars,droplet,trenches,surface,vapor,cooling,coolant,or,layer
地域: MA MA Waltham

摘要

Disclosed herein are cooling systems, methods of making cooling systems, and methods of cooling using cooling systems. A cooling system includes a compression container with a coolant that includes a fluid. A valve is arranged on the compression container through which the coolant is released from the compression container. The cooling system further includes a component positioned to receive droplets of the coolant. The component has a surface with a three-dimensional topography that includes a plurality of pillars and a plurality of trenches. The component is an electronic component or a photoelectronic component.

說明書

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In some aspects, the fluid within the compression container 102 is maintained at a pressure of about 100 to about 8000 pounds per square in gauge (psig). In other aspects, the fluid within the compression container 102 is maintained at a pressure of about 6000 to about 7000 psig.

The compression container 102 includes a valve 104 (also referred to as a porous plug or orifice) through which the coolant 103 is pushed through. The coolant 103 moves through the valve 104 and expands, which results in a decrease in temperature, called the Joule-Thomson effect.

The coolant 103 that comes out of the valve 104 is a fluid 106 of cooling liquid droplets and vapor, or liquid only. According to some aspects, the temperature of the fluid 106 as it is released from the compression container 102 through the valve 104 is about ?200 to about ?40° C. According to other aspects, the temperature of the fluid 106 as it is released from the compression container 102 through the valve 104 is about ?200 to about ?150° C.

A hot surface 108 of a component is positioned to receive a plurality of droplets 112 of the fluid 106 of the coolant 103. The fluid 106 is continuously sprayed onto the hot surface 108 of the component, such as an electronic component or photoelectronic component.

權(quán)利要求

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