A mixture of droplets 112 form between the valve 104 and the hot surface 108. A plurality of droplets 112 form on the hot surface 108, shown in the expanded view in FIG. 1B of one of the droplets 112 in FIG. 1A. The Leidenfrost effect occurs is a vapor layer 114 that forms on the hot surface 108. Although the vapor layer 114 can retard heat absorption, the hot surface 108 is modified with surface features that thin the vapor layer 114 so that the droplet 112 can move closer to the hot surface 108 and increase the rate of cooling of the hot surface 108.

The modified surface includes a three-dimensional topography, such as macroscopic or microscopic features or texture, that thin the vapor layer 114 and allows the droplet 112 to move closer to and eventually touch features of the hot surface 108. The surface features can include, in some aspects, a plurality of pillars 204 and/or a plurality of trenches 206. As the droplet 112 nears the hot surface 108, the vapor spreads out through the trenches 206. Movement of the vapor through the trenches 206 allows the droplet 112 to touch the pillars 204 and exchange heat from the hot surface 108. The hot surface 108 is continuously re-wet when the capillary pressure overcomes the pressure of the vapor layer 114.

According to some aspects, the component with the hot surface 202 is an electronic component, such as a processorchip, or other like small electronics. According to other aspects, the component with the hot surface 202 is a photoelectronic component, such as an infrared (IR) detector.