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Method of manufacturing circuit board and circuit board

專利號
US11553603B2
公開日期
2023-01-10
申請人
TOKIN CORPORATION（JP Sendai）
發(fā)明人
Hiroshi Shima
IPC分類
H05K1/18; H05K3/46; H05K1/02
技術(shù)領(lǐng)域
member,magnetic,pieces,board,cavity,conductor,in,substrate,direction,circuit
地域： Sendai

摘要

A method includes preparing a first substrate member in which a cavity is formed. Moreover, the method includes preparing a magnetic member having a plurality of magnetic pieces. The magnetic member is placed in the cavity, and the second substrate member is placed on the first substrate member to close the cavity. The cavity is defined at least in part by a pair of wall surfaces facing each other in a lateral direction and opens upward in an up-down direction perpendicular to the lateral direction. The magnetic pieces are coupled with each other by positioning members so as to be arranged at regular intervals in a predetermined direction. The placing of the magnetic member in the cavity is carried out so that the predetermined direction coincides with the lateral direction or a front-rear direction perpendicular to both of the lateral direction and the up-down direction.

說明書

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CROSS REFERENCE TO RELATED APPLICATIONS

This application is based on and claims priority under 35 U.S.C. § 119 to Japanese Patent Application No. JP2020-123922 filed Jul. 20, 2020, the contents of which are incorporated herein in their entirety by reference.

BACKGROUND OF THE INVENTION

This invention relates to a method of manufacturing a circuit board and to the circuit board. Particularly, the present invention relates to a method of manufacturing a circuit board which a magnetic member is built in and to the circuit board which the magnetic member is built in.

JP 2020-004966A (Patent Document 1) discloses an example of a circuit board which a magnetic member is built in. The circuit board of Patent Document 1 is provided with a primary substrate with a cavity formed therein, a magnetic member placed in the cavity, an upper prepreg and a lower prepreg. The upper prepreg and the lower prepreg are arranged on an upper surface of the primary substrate and a lower surface of the primary substrate, respectively.

The magnetic member built in the circuit board is used as a magnetic core. In order to obtain desired characteristics as the magnetic core, the magnetic member is generally provided with a gap. Here, a single large gap causes a wide leakage range of magnetic fluxes and gives a large influence on surroundings. Accordingly, in the magnetic member built in the circuit board, it is desirable to employ dispersed gaps which can reduce a leakage range of magnetic fluxes.

權(quán)利要求

1
What is claimed is:1. A method of manufacturing a circuit board, the method comprising:preparing a first substrate member in which a cavity is formed, the cavity being defined at least in part by a pair of wall surfaces facing each other in a lateral direction and opening upward in an up-down direction perpendicular to the lateral direction;preparing a magnetic member having a plurality of magnetic pieces which are coupled with each other by using at least one positioning member so that the magnetic pieces are arranged at regular intervals in a predetermined direction;placing the magnetic member in the cavity so that the predetermined direction coincides with the lateral direction or a front-rear direction perpendicular to both of the lateral direction and the up-down direction; andclosing the cavity by placing a second substrate member on the first substrate member.2. The method as recited in claim 1, wherein:the at least one positioning member is integrally formed with the magnetic pieces using material identical to a material of the magnetic pieces; andthe method further comprises forming at least one via which pierces the first substrate member and the second substrate member so as to pass through the cavity, and through which the at least one positioning member is removed at least in part so that the magnetic pieces are divided from each other.3. The method as recited in claim 2, wherein:the at least one via has a diameter size in a width direction perpendicular to the predetermined direction;the at least one positioning member has a width size in the width direction;the forming of the at least one via is carried out so that the diameter size is larger than the width size;the diameter size and the width size have a first difference therebetween;the cavity and the magnetic member have a second difference in size therebetween in a direction coinciding with the width direction; andthe first difference is larger than the second difference.4. The method as recited in claim 1, wherein the at least one positioning member is made of material different from a material of the magnetic pieces and couples respective surfaces of the magnetic pieces with each other.5. A circuit board comprising a first substrate member, a magnetic member, and a second substrate member, wherein:the first substrate member has a cavity corresponding to the magnetic member formed therein;the cavity is defined at least in part by a pair of wall surfaces facing each other in a lateral direction and opens upward in an up-down direction perpendicular to the lateral direction;the magnetic member has a plurality of magnetic pieces;the magnetic pieces are provided in the cavity and arranged at regular intervals along the lateral direction or a front-rear direction perpendicular to both of the lateral direction and the up-down direction; andthe second substrate member is provided on the first substrate member so as to close the cavity.6. The circuit board as recited in claim 5, wherein:each of the magnetic pieces has at least one side surface facing an adjacent one of the magnetic pieces; andthe at least one side surface has a cut mark remaining thereon or is connected to a positioning member having a cut mark.7. The circuit board as recited in claim 6, wherein:the circuit board further comprises at least one via which pierces the first substrate member and the second substrate member; andeach of the at least one via is in contact with the cut mark of each of two adjacent ones of the magnetic pieces.8. The circuit board as recited in claim 7, wherein:the at least one via has a diameter size in a perpendicular direction perpendicular to the direction in which the magnetic pieces are arranged;the cut mark has a cut mark size in the perpendicular direction;the diameter size is larger than the cut mark size by a first difference;the cavity and the magnetic member have a second difference in size therebetween in the perpendicular direction; andthe first difference is larger than the second difference.9. The circuit board as recited in claim 5, wherein the magnetic pieces are coupled with each other by at least one positioning member which is made of a material different from a material of the magnetic pieces.
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