Referring to FIG. 8 in addition to FIG. 1, the description will be made about a method of manufacturing the circuit board 10 according to the present embodiment.

First, the first substrate member 12 in which the cavity 121 is formed is prepared (Step S801). The cavity 121 may be formed by processing a board member to be the first substrate member 12 or by bonding a frame-shape board member and another board member or a sheet member to each other.

Next, the magnetic member 14 having the plurality of the magnetic pieces 141 is prepared (Step S802). The magnetic pieces 141 may be integrally formed with the positioning members 143. Alternatively, the magnetic pieces 141 may be coupled with one another by the positioning member 143A or the positioning members 1438, wherein each of the positioning member 143A and the positioning members 1438 is made of material different from that of the magnetic pieces 141. At any rate, the magnetic pieces 141 are coupled with one another, and a space between adjacent two of the magnetic pieces 141 is maintained at the predetermined interval.