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Method of manufacturing circuit board and circuit board

專利號(hào)
US11553603B2
公開(kāi)日期
2023-01-10
申請(qǐng)人
TOKIN CORPORATION(JP Sendai)
發(fā)明人
Hiroshi Shima
IPC分類
H05K1/18; H05K3/46; H05K1/02
技術(shù)領(lǐng)域
member,magnetic,pieces,board,cavity,conductor,in,substrate,direction,circuit
地域: Sendai

摘要

A method includes preparing a first substrate member in which a cavity is formed. Moreover, the method includes preparing a magnetic member having a plurality of magnetic pieces. The magnetic member is placed in the cavity, and the second substrate member is placed on the first substrate member to close the cavity. The cavity is defined at least in part by a pair of wall surfaces facing each other in a lateral direction and opens upward in an up-down direction perpendicular to the lateral direction. The magnetic pieces are coupled with each other by positioning members so as to be arranged at regular intervals in a predetermined direction. The placing of the magnetic member in the cavity is carried out so that the predetermined direction coincides with the lateral direction or a front-rear direction perpendicular to both of the lateral direction and the up-down direction.

說(shuō)明書(shū)

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In the circuit board of Patent Document 1, the cavity corresponds to the magnetic member in a one-to-one relationship. In order to form a magnetic core provided with dispersed gaps by the use of this structure, a plurality of cavities and a plurality of magnetic pieces corresponding to the cavities, respectively, are necessary. Here, there is a space between each of the cavities and the magnetic piece corresponding thereto in general. Accordingly, positions of the magnetic pieces each of which is place in the cavity corresponding thereto may have variations, and a gap between adjacent two of the magnetic pieces may have variation. As a result, the magnetic core formed by the use of the structure of Patent Document 1 and provided with the dispersed gaps has a problem that desired characteristics may not be obtained.

SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide a method of manufacturing a circuit board, wherein the method can arrange a plurality of magnetic pieces at regular intervals in a cavity formed in a substrate. Moreover, it is another object of the present invention to provide a circuit board having a plurality of magnetic pieces placed in a cavity thereof and arranged at regular intervals.

權(quán)利要求

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