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Method of manufacturing circuit board and circuit board

專利號
US11553603B2
公開日期
2023-01-10
申請人
TOKIN CORPORATION（JP Sendai）
發(fā)明人
Hiroshi Shima
IPC分類
H05K1/18; H05K3/46; H05K1/02
技術領域
member,magnetic,pieces,board,cavity,conductor,in,substrate,direction,circuit
地域： Sendai

摘要

A method includes preparing a first substrate member in which a cavity is formed. Moreover, the method includes preparing a magnetic member having a plurality of magnetic pieces. The magnetic member is placed in the cavity, and the second substrate member is placed on the first substrate member to close the cavity. The cavity is defined at least in part by a pair of wall surfaces facing each other in a lateral direction and opens upward in an up-down direction perpendicular to the lateral direction. The magnetic pieces are coupled with each other by positioning members so as to be arranged at regular intervals in a predetermined direction. The placing of the magnetic member in the cavity is carried out so that the predetermined direction coincides with the lateral direction or a front-rear direction perpendicular to both of the lateral direction and the up-down direction.

說明書

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

The method of manufacturing the circuit board according to the present invention uses the plurality of the magnetic pieces which are coupled with each other by the at least one positioning member so as to be arranged at regular intervals in the predetermined direction. With this structure, even when a position of the magnetic member varies, an interval between adjacent two of the magnetic pieces does not vary. Thus, the method according to the present invention can manufacture the circuit board having the magnetic pieces which are placed in the cavity formed in the substrate and which is arranged at the regular intervals.

An appreciation of the objectives of the present invention and a more complete understanding of its structure may be had by studying the following description of the preferred embodiment and by referring to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded, perspective view showing a circuit board before forming a conductor portion according to an embodiment of the present invention.

FIG. 2 is a plan view showing a magnetic member included in the circuit board of FIG. 1.

FIG. 3 is a front view showing the magnetic member of FIG. 2.

FIG. 4 is a plan view showing a modified example of the magnetic member of FIG. 2.

FIG. 5 is a front view showing the magnetic member of FIG. 4.

權利要求

1
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