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Laminated circuit board device

專利號(hào)
US11564308B2
公開日期
2023-01-24
申請(qǐng)人
Yazaki Corporation（JP Tokyo）
發(fā)明人
Tsunehiro Watanabe
IPC分類
H05K1/02
技術(shù)領(lǐng)域
pattern,wiring,layer,p1p,i2b,i2a,circuit,power,in,induction
地域： Tokyo

摘要

A circuit pattern of a power line and a circuit pattern of a signal line are disposed in a first layer of a laminated circuit board device, a circuit pattern of the signal line to be protected is disposed in a second layer, and a circuit pattern of a power line is disposed in a third layer. The shapes of the first circuit pattern of the power line of the first layer and the second circuit pattern of the power line of the third layer are substantially matched with each other with respect to a portion of the second layer facing the circuit pattern of the signal line. The direction of the current of the first circuit pattern coincides with the direction of the current of the second circuit pattern.

說明書

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based on and claims priority from Japanese patent application No. 2020-162414 filed on Sep. 28, 2020, the entire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a laminated circuit board device including laminated circuit patterns of a plurality of layers.

BACKGROUND ART

In various electronic circuits such as an in-vehicle device, a malfunction may occur or the performance of the device may decrease due to an influence of noise generated from other devices, wiring, or the like existing at an adjacent position. Therefore, various kinds of noise countermeasures have been taken at the time of designing the device and the time of disposing the device.

For example, Patent Literature JP-A-11-220056 discloses a technique for reducing an inductance of a wiring or a wiring lead in a semiconductor package disposed on a general wiring board and reducing an inductive crosstalk. Specifically, a predetermined wiring is disposed on an insulating board, and an electromagnetic wave shielding film (metal foil) is disposed at a position close to the wiring. In addition, an electromagnetic wave shielding film is disposed on a surface of a semiconductor chip on which an integrated circuit is formed with an insulating film interposed therebetween, a lead is disposed on the electromagnetic wave shielding film with an insulating film interposed therebetween, and the lead and an external terminal of the semiconductor chip are electrically connected to each other, and sealed with a sealing material to form a semiconductor device.

權(quán)利要求

1
What is claimed is:1. A laminated circuit board device, comprisinga first layer, a second layer, and a third layer, whereinthe first layer and the second layer are separated by an first insulator, and the second layer and the third layer are separated by a second insulator, and the second layer is disposed between the first layer and the third layer,patterns of the first layer, the second layer, and the third layer are formed on different surfaces parallel to each other by a foil-like conductor,a first circuit pattern of an electric power system and a first circuit pattern of a signal system are disposed in the first layer, respectively, the first circuit pattern of the electric power system is configured to pass a current flowing between a predetermined power source and a predetermined load, and the first circuit pattern of the signal system is configured to pass a current smaller than the currently flowing through the of the power system,a second circuit pattern of the signal system is disposed in the second layer, anda second circuit pattern of the electric power system is disposed in the third layer,shapes of the first circuit pattern of the electric power system of the first layer and the second circuit pattern of the electric power system of the third layer substantially coincide with each other, for portions of the first circuit pattern of the electrical power system and the second circuit pattern of the second circuit pattern facing a protection portion of at least a part of the second circuit pattern of the signal system in the second layer, andthe first circuit pattern of electric power system and the second circuit pattern of the electric power system are configured such that a direction of the current flowing through the first circuit pattern of the electric power system and a direction of the current flowing through the second circuit pattern of the electric power system coincide with each other.2. The laminated circuit board device according to claim 1, whereinin the first circuit pattern of the electric power system, a pattern width in a direction orthogonal to the direction of the current flowing through the portion is formed to be a specific width, andin the second circuit pattern of the electric power system, a pattern width in a direction orthogonal to the direction of the current flowing through the portion is formed to have the same specific width as the first circuit pattern.3. The laminated circuit board device according to claim 1, whereinfor each of the first circuit pattern of the electric power system and the second circuit pattern of the electric power system,a branching portion and a merging portion are formed between one end and the other end through which a current flows, anda shape is defined such that the sum of the pattern widths of a plurality of current paths formed between the branching portion and the merging portion is the same in the first circuit pattern of the electric power system and the second circuit pattern of the electric power system.4. The laminated circuit board device according to claim 1, whereinone end of the first circuit pattern of the electric power system and one end of the second circuit pattern of the electric power system are configured to be connectable to one of a common power source or a common load via a common circuit on one end side, andthe other end of the first circuit pattern of the electric power system and the other end of the second circuit pattern of the electric power system are configured to be connectable to another of the common load or the common power source via a common circuit on the other end side.5. The laminated circuit board device according to claim 4, wherein the first circuit pattern of the electric power system is configured to pass a current of several amperes or more, and the first circuit pattern of the signal system is configured to pass a current of about several milliamperes.6. The laminated circuit board device according to claim 1, whereinthe first layer, the second layer, and the third layer are formed as independent layers having different positions in the thickness direction on a single printed circuit board, andat least the first circuit pattern of the electric power system of the first layer and the second circuit pattern of the power system of the third layer have a uniform thickness, and the first circuit pattern of the electric power system of the first layer and the second circuit pattern of the electric power system of the third layer are formed of foil-like conductors having a common thickness.
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