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Laminated circuit board device

專利號
US11564308B2
公開日期
2023-01-24
申請人
Yazaki Corporation(JP Tokyo)
發(fā)明人
Tsunehiro Watanabe
IPC分類
H05K1/02
技術(shù)領(lǐng)域
pattern,wiring,layer,p1p,i2b,i2a,circuit,power,in,induction
地域: Tokyo

摘要

A circuit pattern of a power line and a circuit pattern of a signal line are disposed in a first layer of a laminated circuit board device, a circuit pattern of the signal line to be protected is disposed in a second layer, and a circuit pattern of a power line is disposed in a third layer. The shapes of the first circuit pattern of the power line of the first layer and the second circuit pattern of the power line of the third layer are substantially matched with each other with respect to a portion of the second layer facing the circuit pattern of the signal line. The direction of the current of the first circuit pattern coincides with the direction of the current of the second circuit pattern.

說明書

On the other hand, in the state of FIG. 5B, outside the current i2b, the magnetic field strength due to the current i2a is inversely proportional to (r+d), the magnetic field strength due to the current i2b is inversely proportional to (r?d), and the directions of the induction magnetic fields H2a, H2b are opposite to each other. Therefore, at a distant position separated by a very large distance r (r>>d) from the intermediate position, the influence of the induction magnetic fields H2a, H2b becomes almost the same, and the induction magnetic fields H2a. H2b cancel each other out.

That is, in the example of FIG. 5B, the outside of each position of the currents i2a, i2b becomes a canceling region, and noise can be reduced within that range. However, noise increases in the range on the inner side of each position of the currents i2a, i2b.

<Examples of Waveforms>

FIG. 6 is a time chart illustrating an example of a voltage waveform and a noise waveform.

權(quán)利要求

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